Chip powers are on the rise and expected to double every 2-3 years for PCs and data centers. Never has there been a more urgent need for high performance cooling. Co-founder and Chief Strategy Officer, Arian Aghababaie, presents on how Holo PureFormTMtechnology coupled withnTop Platformcan reduce energy consumption, enhance liquid cooling performance and increase processor powers. Arian will also walk through a real example of how a 3D printed pure copper liquid coldplate can triple the operating power of a high-end PC chip, demonstrating that design freedom for additive manufacturing creates value. Watch the webinar below.