--- title: Holo to Present at nTopology's Metal DfAM Series | Holo Blog description: Holo, Inc. presents at software partner nTopology's metal design for additive manufacturing eSeries as part of the heat exchanger cohort. image: https://holoam.com/hubfs/holo%20coldplate.jpeg --- [Skip to content](https://holoam.com/blog/holo-present-ntopologys-dfam-series#main-content) [![holo logo](https://holoam.com/hs-fs/hubfs/titillium-logo-blue-1280x713-1.png?width=150&height=103&name=titillium-logo-blue-1280x713-1.png)](https://22488590.hs-sites.com/) - [TECHNOLOGY](https://holoam.com/technology) - RESOURCES Show submenu for RESOURCES - [BLOG](https://holoam.com/blog) - [LEARN](https://holoam.com/learn) - [PRESS](https://holoam.com/press) - [COMPANY](https://holoam.com/company) - [CAREERS](https://22488590.hs-sites.com/company#hiring) - [CONTACT](https://holoam.com/contact) Open main navigation Close main navigation - [TECHNOLOGY](https://holoam.com/technology) - RESOURCES Show submenu for RESOURCES - [BLOG](https://holoam.com/blog) - [LEARN](https://holoam.com/learn) - [PRESS](https://holoam.com/press) - [COMPANY](https://holoam.com/company) - [CAREERS](https://22488590.hs-sites.com/company#hiring) - [CONTACT](https://holoam.com/contact) - [BOOK A CONSULT](https://holoam.com/request-a-consult) [BOOK A CONSULT](https://holoam.com/request-a-consult) [All posts](https://holoam.com/blog/all) April 5, 2023 # Holo to Present at nTopology’s Additive Manufacturing Design Series By  [Holo Team](https://holoam.com/blog/author/holo-team)  ·  1 minute read ##### Holo, will be taking part in the upcoming [design for additive manufacturing (DfAM) e-series](https://ntopology.com/design-for-additive-manufacturing-dfam-for-metal-processes/) hosted by leading DfAM software company, [nTopology](https://ntopology.com/). Together with experts in the field, Holo’s co-founder and Chief Strategy Officer, Arian Aghababaie will present on August 11th as part of the Heat Exchangers cohort, along with Jean-Michel Hugo of TEMISTh and Maiki Vlahinos of nTopology. ##### Aghababaie will discuss how the design freedom enabled by additive manufacturing, creates value through substantial levels of improvement in product performance. Specifically, Aghababaie will detail how Holo is tackling the thermal management problem in the cooling of high-end processors for data centers and PCs. ##### “nTopology is very excited to have Holo, Inc. join our DfAM for metal processes series,” says Duann Scott, VP of Marketing, nTopology. “With the belief that design freedom creates value, Holo has proven success in producing 3D printed liquid cooled devices that enhance performance. Holo’s expertise will be beneficial for customers trying to solve the toughest chip cooling problems.” ##### Aghababaie will walk through how Holo’s PureForm™ technology platform enables the production of high-resolution, pure copper parts, opening up the design space for thermal engineers and designers. Coupled with nTopology’s DfAM software and the rapid iteration cycles and capabilities of PureForm™, Aghababaie will demonstrate how a 3D printed liquid cold plate can triple the operating power of a high-end PC chip. ##### “We are proud to be an nTopology partner and take part in this e-series together with our industry peers,” said Arian Aghababaie, co-founder & Chief Strategy Officer, Holo. “We are looking forward to demonstrate how the pairing of nToplogy’s DfAM software and our PureForm™ technology delivers tangible performance gains, created through design freedom”   **About Holo ** Holo creates value through design freedom. The company’s PureForm™ technology platform has been built from the ground up to provide customers with high performance products from prototype through volume supply. Founded by pioneers in the additive manufacturing industry, the company leads with expertise in material science, 3D printing hardware, software and design for additive manufacturing. Holo is a Silicon Valley startup, backed by leading investors, including: Prelude Ventures, Lightspeed Venture Partners, Tao Capital, Autodesk and Aurus Capital. The company is based in Newark, California. Share: [facebook-f icon](http://www.facebook.com/share.php?u=https://holoam.com/blog/holo-present-ntopologys-dfam-series) [linkedin-in icon](http://www.linkedin.com/shareArticle?mini=true&url=https://holoam.com/blog/holo-present-ntopologys-dfam-series) [twitter icon](https://twitter.com/intent/tweet?url=https://holoam.com/blog/holo-present-ntopologys-dfam-series) [envelope icon](mailto:?body=https://holoam.com/blog/holo-present-ntopologys-dfam-series) ## Related posts [![printed gpu coldplate](https://holoam.com/hubfs/holo%20pure%20copper%20coldplate.jpeg)](https://holoam.com/blog/webinar-high-performance-additive) [Events](https://holoam.com/blog/tag/events) ### [Creating the Highest Performance Cooling Solutions in 3D Printed Pure Copper](https://holoam.com/blog/webinar-high-performance-additive) [![printed coldplate](https://holoam.com/hubfs/pure%20copper%203d%20printed%20coldplate.jpeg)](https://holoam.com/blog/webinar-high-performance-solutions) [Events](https://holoam.com/blog/tag/events) ### [Webinar: Creating High Performance Solutions from Design to Production](https://holoam.com/blog/webinar-high-performance-solutions) [![ASTM Holo ](https://holoam.com/hubfs/Holo%20ASTM%20ICAM.png)](https://holoam.com/blog/astm-icam) [Events](https://holoam.com/blog/tag/events) ### [Holo to Present at ASTM International Conference on Additive Manufacturing](https://holoam.com/blog/astm-icam) ```json { "@context" : "https://schema.org", "@type" : "BlogPosting", "author" : { "@type" : "Person", "name" : "Holo Team", "url" : "https://holoam.com/blog/author/holo-team" }, "dateModified" : "2023-04-05T00:33:18.762Z", "datePublished" : "2020-08-10T07:00:00.000Z", "headline" : "Holo to Present at nTopology's Metal DfAM Series | Holo Blog", "image" : [ "https://holoam.com/hubfs/holo%20coldplate.jpeg" ], "mainEntityOfPage" : { "@id" : "https://holoam.com/blog/holo-present-ntopologys-dfam-series", "@type" : "WebPage" }, "publisher" : { "@type" : "Organization", "logo" : { "@type" : "ImageObject", "url" : "https://holoam.com/hubfs/titillium-logo-blue-1280x713-1.png" }, "name" : "Holo" } } ``` ```json { "@context" : "http://schema.org", "@type" : "Article", "author" : { "@type" : "Person", "name" : [ "Holo Team" ], "url" : "https://holoam.com/blog/author/holo-team" }, "datePublished" : "2020-08-10T07:00:00+0000", "description" : "Holo, Inc. presents at software partner nTopology's metal design for additive manufacturing eSeries as part of the heat exchanger cohort.", "headline" : "Holo to Present at nTopology’s Additive Manufacturing Design Series", "image" : "https://22488590.fs1.hubspotusercontent-na1.net/hubfs/22488590/holo%20coldplate.jpeg", "publisher" : { "@type" : "Organization", "logo" : { "@type" : "ImageObject", "url" : "https://holoam.com/hubfs/titillium-logo-blue-1280x713-1.png" }, "name" : "Holo, Inc." }, "url" : "https://holoam.com/blog/holo-present-ntopologys-dfam-series" } ```